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1

Mechanical reliability of Sn-rich Au–Sn/Ni flip chip solder joints fabricated by sequential electroplating method

Jeong-Won Yoon, Hyun-Suk Chun, Bo-In Noh, Ja-Myeong Koo, Jong-Woong Kim, Hoo-Jeong Lee, Seung-Boo Jung

Journal:

Microelectronics Reliability

Année:

2008

Langue:

english

Fichier:

PDF, 1.76 MB

english, 2008

2

Au–Sn flip-chip solder bump for microelectronic and optoelectronic applications

Jeong-Won Yoon, Hyun-Suk Chun, Ja-Myeong Koo, Seung-Boo Jung

Journal:

Microsystem Technologies

Année:

2007

Langue:

english

Fichier:

PDF, 452 KB

english, 2007

3

Effects of isothermal aging and temperature–humidity treatment of substrate on joint reliability of Sn–3.0Ag–0.5Cu/OSP-finished Cu CSP solder joint

Jeong-Won Yoon, Bo-In Noh, Young-Ho Lee, Hyo-Soo Lee, Seung-Boo Jung

Journal:

Microelectronics Reliability

Année:

2008

Langue:

english

Fichier:

PDF, 1.09 MB

english, 2008

4

Investigation of interfacial reaction and joint reliability between eutectic Sn–3.5Ag solder and ENIG-plated Cu substrate during high temperature storage test

Jeong-Won Yoon, Hyun-Suk Chun, Seung-Boo Jung

Journal:

Journal of Materials Science: Materials in Electronics

Année:

2007

Langue:

english

Fichier:

PDF, 673 KB

english, 2007

5

Interfacial reaction and mechanical properties between low melting temperature Sn–58Bi solder and various surface finishes during reflow reactions

Lee, Sang-Min, Yoon, Jeong-Won, Jung, Seung-Boo

Journal:

Journal of Materials Science: Materials in Electronics

Année:

2015

Langue:

english

Fichier:

PDF, 4.55 MB

english, 2015

6

Sequential interfacial reactions of SAC305 solder joints with thin ENEPIG surface finishes

Yoon, Jeong-Won, Back, Jong-Hoon, Jung, Seung-Boo

Journal:

Surface and Interface Analysis

Année:

2018

Langue:

english

Fichier:

PDF, 1.40 MB

english, 2018

7

Reliability of Au bump flip chip packages with adhesive materials using four-point bending test

Bo-In Noh, Jeong-Won Yoon, Jong-Woong Kim, Jong-Bum Lee, Noh-Chang Park, Won-Sik Hong, Seung-Boo Jung

Journal:

International Journal of Adhesion and Adhesives

Année:

2009

Langue:

english

Fichier:

PDF, 449 KB

english, 2009

8

Solder joint reliability evaluation of Sn–Zn/Au/Ni/Cu ball-grid-array package during aging

Jeong-Won Yoon, Seung-Boo Jung

Journal:

Materials Science and Engineering: A

Année:

2007

Langue:

english

Fichier:

PDF, 3.14 MB

english, 2007

9

Reliability evaluation of Au–20Sn flip chip solder bump fabricated by sequential electroplating method with Sn and Au

Jeong-Won Yoon, Hyun-Suk Chun, Seung-Boo Jung

Journal:

Materials Science and Engineering: A

Année:

2008

Langue:

english

Fichier:

PDF, 1.26 MB

english, 2008

10

Interfacial reactions and joint reliability of Sn–9Zn solder on Cu or electrolytic Au/Ni/Cu BGA substrate

Chang-Yong Lee, Jeong-Won Yoon, Young-Jig Kim, Seung-Boo Jung

Journal:

Microelectronic Engineering

Année:

2005

Langue:

english

Fichier:

PDF, 647 KB

english, 2005

11

Interfacial reaction and joint reliability of fine-pitch flip-chip solder bump using stencil printing method

Sang-Su Ha, Dae-Gon Kim, Jong-Woong Kim, Jeong-Won Yoon, Jin-Ho Joo, Young-Eui Shin, Seung-Boo Jung

Journal:

Microelectronic Engineering

Année:

2007

Langue:

english

Fichier:

PDF, 961 KB

english, 2007

12

Mechanical reliability evaluation of Sn-37Pb solder joint using high speed lap-shear test

Seong-jae Jeon, Seungmin Hyun, Hak-Joo Lee, Jong-Woong Kim, Sang-Su Ha, Jeong-Won Yoon, Seung-Boo Jung, Hoo-Jeong Lee

Journal:

Microelectronic Engineering

Année:

2008

Langue:

english

Fichier:

PDF, 774 KB

english, 2008

13

Influence of current density on mechanical reliability of Sn–3.5Ag BGA solder joint

Sang-Su Ha, Ji-Yoon Sung, Jeong-Won Yoon, Seung-Boo Jung

Journal:

Microelectronic Engineering

Année:

2011

Langue:

english

Fichier:

PDF, 1.95 MB

english, 2011

14

Fabrication and adhesion strength of Cu/Ni–Cr/polyimide films for flexible printed circuits

Bo-In Noh, Jeong-Won Yoon, Seung-Boo Jung

Journal:

Microelectronic Engineering

Année:

2011

Langue:

english

Fichier:

PDF, 523 KB

english, 2011

15

High temperature reliability and interfacial reaction of eutectic Sn–0.7Cu/Ni solder joints during isothermal aging

Jeong-Won Yoon, Seung-Boo Jung

Journal:

Microelectronics Reliability

Année:

2006

Langue:

english

Fichier:

PDF, 950 KB

english, 2006

16

Characteristic analysis of electroless Ni plating layer for electronic packaging

Dae-Gon Kim, Jong-Woong Kim, Jeong-Won Yoon, Won-Bae Lee, Seung-Boo Jung

Journal:

Surface and Interface Analysis

Année:

2006

Langue:

english

Fichier:

PDF, 190 KB

english, 2006

17

Adhesion characteristics of Cu/Ni–Cr/polyimide flexible copper clad laminates according to Ni:Cr ratio and Cu electroplating layer thickness

Bo-In Noh, Jeong-Won Yoon, Bo-Young Lee, Seung-Boo Jung

Journal:

Journal of Materials Science: Materials in Electronics

Année:

2009

Langue:

english

Fichier:

PDF, 478 KB

english, 2009

18

Interfacial reaction between Au–Sn solder and Au/Ni-metallized Kovar

Jeong-Won Yoon, Bo-In Noh, Seung-Boo Jung

Journal:

Journal of Materials Science: Materials in Electronics

Année:

2011

Langue:

english

Fichier:

PDF, 784 KB

english, 2011

19

Effect of adding Ce on interfacial reactions between Sn–Ag solder and Cu

Jeong-Won Yoon, Bo-In Noh, Jung-Hyun Choi, Seung-Boo Jung

Journal:

Journal of Materials Science: Materials in Electronics

Année:

2011

Langue:

english

Fichier:

PDF, 728 KB

english, 2011

20

Effects of different kinds of seed layers and heat treatment on adhesion characteristics of Cu/(Cr or Ni–Cr)/PI interfaces in flexible printed circuits

Bo-In Noh, Jeong-Won Yoon, Bo-Young Lee, Seung-Boo Jung

Journal:

Journal of Materials Science: Materials in Electronics

Année:

2011

Langue:

english

Fichier:

PDF, 675 KB

english, 2011

21

Microstructure of interfacial reaction layer in Sn–Ag–Cu/electroless Ni (P) solder joint

Han-Byul Kang, Jee-Hwan Bae, Jeong-Won Yoon, Seung-Boo Jung, Jongwoo Park, Cheol-Woong Yang

Journal:

Journal of Materials Science: Materials in Electronics

Année:

2011

Langue:

english

Fichier:

PDF, 388 KB

english, 2011

22

Thermo-compression bonding of electrodes between FPCB and RPCB by using Pb-free solders

Jeong-Won Yoon, Jong-Gun Lee, Jong-Bum Lee, Bo-In Noh, Seung-Boo Jung

Journal:

Journal of Materials Science: Materials in Electronics

Année:

2012

Langue:

english

Fichier:

PDF, 706 KB

english, 2012

23

Interfacial reactions and shear strengths between Sn-Ag-based Pb-free solder balls and Au/EN/Cu metallization

Sang-Won Kim, Jeong-Won Yoon, Seung-Boo Jung

Journal:

Journal of Electronic Materials

Année:

2004

Langue:

english

Fichier:

PDF, 1.22 MB

english, 2004

24

Microstructure, Electrical Properties, and Electrochemical Migration of a Directly Printed Ag Pattern

Bo-In Noh, Jeong-Won Yoon, Kwang-Seok Kim, Young-Chul Lee, Seung-Boo Jung

Journal:

Journal of Electronic Materials

Année:

2011

Langue:

english

Fichier:

PDF, 913 KB

english, 2011

25

Comparative Study of ENIG and ENEPIG as Surface Finishes for a Sn-Ag-Cu Solder Joint

Jeong-Won Yoon, Bo-In Noh, Seung-Boo Jung

Journal:

Journal of Electronic Materials

Année:

2011

Langue:

english

Fichier:

PDF, 619 KB

english, 2011

26

Solder joint reliability in flip chip package with surface treatment of ENIG under thermal shock test

Sang-Su Ha, Sang-Ok Ha, Jeong-Won Yoon, Jong-Woong Kim, Min-Kwan Ko, Dae-Gon Kim, Sung-Jin Kim, Tae-Hwan Hong, Seung-Boo Jung

Journal:

Metals and Materials International

Année:

2009

Langue:

english

Fichier:

PDF, 1.59 MB

english, 2009

27

Mechanical strength and fracture mode transition of Sn-58Bi epoxy solder joints under high-speed shear test

Ilje Cho, Jee-Hyuk Ahn, Jeong-Won Yoon, Young-Eui Shin, Seung-Boo Jung

Journal:

Journal of Materials Science: Materials in Electronics

Année:

2012

Langue:

english

Fichier:

PDF, 638 KB

english, 2012

28

Gel-type autologous chondrocyte (Chondron™) implantation for treatment of articular cartilage defects of the knee

Nam-Yong Choi, Byoung-Woo Kim, Woo-Jin Yeo, Haeng-Boo Kim, Dong-Sam Suh, Jin-Soo Kim, Yoon-Sik Kim, Yong-Ho Seo, Jea-Yeong Cho, Chung-Woo Chun, Hyun-Shin Park, Asode Ananthram Shetty, Seok-Jung Kim

Journal:

BMC Musculoskeletal Disorders

Année:

2010

Langue:

english

Fichier:

PDF, 1.11 MB

english, 2010

29

Interfacial reaction and mechanical properties of eutectic Sn–0.7Cu/Ni BGA solder joints during isothermal long-term aging

Jeong-Won Yoon, Sang-Won Kim, Seung-Boo Jung

Journal:

Journal of Alloys and Compounds

Année:

2005

Langue:

english

Fichier:

PDF, 634 KB

english, 2005

30

IMC morphology, interfacial reaction and joint reliability of Pb-free Sn–Ag–Cu solder on electrolytic Ni BGA substrate

Jeong-Won Yoon, Sang-Won Kim, Seung-Boo Jung

Journal:

Journal of Alloys and Compounds

Année:

2005

Langue:

english

Fichier:

PDF, 702 KB

english, 2005

31

Effects of reflow and cooling conditions on interfacial reaction and IMC morphology of Sn–Cu/Ni solder joint

Jeong-Won Yoon, Sang-Won Kim, Seung-Boo Jung

Journal:

Journal of Alloys and Compounds

Année:

2006

Langue:

english

Fichier:

PDF, 736 KB

english, 2006

32

Reliability studies of Sn–9Zn/Cu solder joints with aging treatment

Jeong-Won Yoon, Seung-Boo Jung

Journal:

Journal of Alloys and Compounds

Année:

2006

Langue:

english

Fichier:

PDF, 1.75 MB

english, 2006

33

Solid-state interfacial reactions between Sn–3.5Ag–0.7Cu solder and electroless Ni-immersion Au substrate during high temperature storage test

Hyun-Suk Chun, Jeong-Won Yoon, Seung-Boo Jung

Journal:

Journal of Alloys and Compounds

Année:

2007

Langue:

english

Fichier:

PDF, 1.53 MB

english, 2007

34

Wettability and interfacial reactions of Sn–Ag–Cu/Cu and Sn–Ag–Ni/Cu solder joints

Jeong-Won Yoon, Bo-In Noh, Bong-Kyun Kim, Chang-Chae Shur, Seung-Boo Jung

Journal:

Journal of Alloys and Compounds

Année:

2009

Langue:

english

Fichier:

PDF, 1.71 MB

english, 2009

35

Electrical properties and electrochemical migration characteristics of directly printed Ag patterns with various sintering conditions

Yoon, Jeong-Won, Noh, Bo-In, Jung, Seung-Boo

Journal:

Microelectronics Reliability

Année:

2014

Langue:

english

Fichier:

PDF, 4.39 MB

english, 2014

36

Joint reliability evaluation of thermo-compression bonded FPCB/RPCB joints under high temperature storage test

Yoon, Jeong-Won, Ko, Min-Kwan, Noh, Bo-In, Jung, Seung-Boo

Journal:

Microelectronics Reliability

Année:

2013

Langue:

english

Fichier:

PDF, 3.11 MB

english, 2013

37

Effects of Underfill Materials and Thermal Cycling on Mechanical Reliability of Chip Scale Package

Bo-In Noh,, Jeong-Won Yoon,, Seung-Boo Jung,

Journal:

IEEE Transactions on Components and Packaging Technologies

Année:

2009

Langue:

english

Fichier:

PDF, 1.38 MB

english, 2009

38

Comparison of Interfacial Stability of Pb-Free Solders (Sn—3.5Ag, Sn—3.5Ag—0.7Cu, and Sn—0.7Cu) on ENIG-Plated Cu During Aging

Jeong-Won Yoon,, Bo-In Noh,, Seung-Boo Jung,

Journal:

IEEE Transactions on Components and Packaging Technologies

Année:

2010

Langue:

english

Fichier:

PDF, 1.01 MB

english, 2010

39

Mechanical Reliability of Sn-Ag BGA Solder Joints With Various Electroless Ni-P and Ni-B Plating Layers

Jeong-Won Yoon,, Bo-In Noh,, Seung-Boo Jung,

Journal:

IEEE Transactions on Components and Packaging Technologies

Année:

2010

Langue:

english

Fichier:

PDF, 1.09 MB

english, 2010

40

Electromigration effect on Sn-58 % Bi solder joints with various substrate metallizations under current stress

Lee, Sang-Min, Yoon, Jeong-Won, Jung, Seung-Boo

Journal:

Journal of Materials Science: Materials in Electronics

Année:

2016

Langue:

english

Fichier:

PDF, 2.20 MB

english, 2016

41

Long-term efficacy of biofeedback therapy in patients with dyssynergic defecation: results of a median 44 months follow-up

Lee, H. J., Boo, S.-J., Jung, K. W., Han, S., Seo, S. Y., Koo, H. S., Yoon, I. J., Park, S. H., Yang, D.-H., Kim, K.-J., Ye, B. D., Byeon, J.-S., Yang, S.-K., Kim, J.-H., Myung, S.-J.

Journal:

Neurogastroenterology & Motility

Année:

2015

Langue:

english

Fichier:

PDF, 404 KB

english, 2015

42

Sonography of Axillary Masses

Kim, Eun Young, Ko, Eun Young, Han, Boo-Kyung, Shin, Jung Hee, Hahn, Soo Yeon, Kang, Seok Seon, Cho, Eun Yoon, Kim, Min Jung, Chun, Sun Young

Journal:

Journal of Ultrasound in Medicine

Année:

2009

Langue:

english

Fichier:

PDF, 1.89 MB

english, 2009

43

Effect of surface finish metallization on mechanical strength of Ag sintered joint

Yoon, Jeong-Won, Back, Jong-Hoon, Jung, Seung-Boo

Journal:

Microelectronic Engineering

Année:

2018

Langue:

english

Fichier:

PDF, 3.86 MB

english, 2018

44

Prenatally Detected Congenital Perineal Mass Using 3D Ultrasound which was Diagnosed as Lipoblastoma Combined with Anorectal Malformation: Case Report

Ahn, Ki Hoon, Boo, Yoon Jung, Seol, Hyun Joo, Park, Hyun Tae, Hong, Soon Cheol, Oh, Min Jeong, Kim, Tak, Kim, Hai Joong, Kim, Young Tae, Kim, Sun Haeng, Lee, Kyu Wan

Journal:

Journal of Korean Medical Science

Année:

2010

Langue:

english

Fichier:

PDF, 1.41 MB

english, 2010

45

[IEEE 2019 International Conference on Platform Technology and Service (PlatCon) - Jeju, Korea (South) (2019.1.28-2019.1.30)] 2019 International Conference on Platform Technology and Service (PlatCon) - TAPS: Trust-based Access Control and Protect System

Yoo, Yoon-Sik, Lee, Hyungkyu, Jung, Boo-Geum, Park, HeaSook, Kim, Kiwon, Park, Cheong Hee

Année:

2019

Langue:

english

Fichier:

PDF, 1.29 MB

english, 2019

46

[IEEE 2018 IEEE 20th Electronics Packaging Technology Conference (EPTC) - Singapore, Singapore (2018.12.4-2018.12.7)] 2018 IEEE 20th Electronics Packaging Technology Conference (EPTC) - A Study of the Growth Rate of Cu-Sn Intermetallic Compounds for Transient Liquid Phase Bonding during Isothermal Aging

Jeong, So-Eun, Jung, Seung-Boo, Yoon, Jeong-Won

Année:

2018

Langue:

english

Fichier:

PDF, 238 KB

english, 2018

47

Overexpression of glutathione peroxidase-1 attenuates cocaine-induced reproductive dysfunction in male mice by inhibiting nuclear factor κB

Mai, Huynh Nhu, Chung, Yoon Hee, Shin, Eun-Joo, Jeong, Ji Hoon, Jung, Tae Woo, Sharma, Naveen, Lei, Xin Gen, Nah, Seung-Yeol, Jang, Choon-Gon, Kim, Dae-Joong, Yang, Boo-Keun, Kim, Hyoung-Chun

Journal:

Chemico-Biological Interactions

Année:

2019

Langue:

english

Fichier:

PDF, 7.39 MB

english, 2019

48

Effects of Ni layer thickness of thin-ENEPIG surface finishes on the interfacial reactions and shear strength of Sn-3.0Ag–0.5Cu solder joints during aging

Kim, Jungsoo, Back, Jong-Hoon, Jung, Seung-Boo, Yoon, Jeong-Won

Journal:

Journal of Materials Science: Materials in Electronics

Année:

2019

Langue:

english

Fichier:

PDF, 4.44 MB

english, 2019

49

Gastric neuroendocrine carcinoma: Clinicopathologic review and immunohistochemical study of E-cadherin and Ki-67 as prognostic markers

Yoon-Jung Boo, Sung-Soo Park, Jong-Han Kim, Young-Jae Mok, Seong-Joo Kim, Chong-Suk Kim

Journal:

Journal of Surgical Oncology

Année:

2007

Langue:

english

Fichier:

PDF, 299 KB

english, 2007

50

Characteristics of metastasis in the breast from extramammary malignancies

Se Kyung Lee, Wan Wook Kim, Sung Hoon Kim, Sung Mo Hur, Sangmin Kim, Jae Hyuck Choi, Eun Yoon Cho, Soo Yeon Han, Boo-Kyung Hahn, Jun-Ho Choe, Jung-Han Kim, Jee Soo Kim, Jeong Eon Lee, Seok Jin Nam, Ju

Journal:

Journal of Surgical Oncology

Année:

2010

Langue:

english

Fichier:

PDF, 113 KB

english, 2010